JPS6246295Y2 - - Google Patents
Info
- Publication number
- JPS6246295Y2 JPS6246295Y2 JP1982091191U JP9119182U JPS6246295Y2 JP S6246295 Y2 JPS6246295 Y2 JP S6246295Y2 JP 1982091191 U JP1982091191 U JP 1982091191U JP 9119182 U JP9119182 U JP 9119182U JP S6246295 Y2 JPS6246295 Y2 JP S6246295Y2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- printed wiring
- wiring board
- bonding
- thermocompression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 239000011889 copper foil Substances 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 230000003014 reinforcing effect Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982091191U JPS58193661U (ja) | 1982-06-17 | 1982-06-17 | 印刷配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982091191U JPS58193661U (ja) | 1982-06-17 | 1982-06-17 | 印刷配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58193661U JPS58193661U (ja) | 1983-12-23 |
JPS6246295Y2 true JPS6246295Y2 (en]) | 1987-12-12 |
Family
ID=30099600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982091191U Granted JPS58193661U (ja) | 1982-06-17 | 1982-06-17 | 印刷配線板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58193661U (en]) |
-
1982
- 1982-06-17 JP JP1982091191U patent/JPS58193661U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58193661U (ja) | 1983-12-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0593069U (ja) | プリント回路基板 | |
JPH0715122A (ja) | 接合用フィルム構体および電子部品実装方法 | |
JPS6246295Y2 (en]) | ||
JPH0528066U (ja) | 多層基板とフレキシブル基板との取付構造 | |
JPS5930555Y2 (ja) | プリント基板 | |
JPH0625017Y2 (ja) | Lsiパッケ−ジのリ−ド構造 | |
JP3924073B2 (ja) | 回路基板と導体片との接続方法 | |
JP3321660B2 (ja) | 端子片付き基板構造 | |
JP2636332B2 (ja) | プリント基板 | |
JP2002374060A (ja) | 電子回路板 | |
JP2821070B2 (ja) | 複合プリント基板の接合方法 | |
JP2530547Y2 (ja) | プリント配線基板 | |
JPS61102089A (ja) | フラツトパツケ−ジicの実装構造 | |
JPH05121868A (ja) | プリント基板に対する電子部品の半田付け実装方法 | |
JP3223592B2 (ja) | 基板上でのバンプ電極の形成方法 | |
JPS5932151Y2 (ja) | フレキシブル印刷配線板の多層接続構造 | |
JPS6244554Y2 (en]) | ||
JP3905024B2 (ja) | 半導体パッケージの実装構造 | |
JPH0336786A (ja) | プリント基板への部品実装方法 | |
JPH0342691Y2 (en]) | ||
JPH04329659A (ja) | 混成集積回路装置およびその製造方法 | |
JPS5926620Y2 (ja) | 印刷配線板 | |
JPH0547466Y2 (en]) | ||
JPH05152734A (ja) | プリント基板に対する電子部品の半田付け実装方法 | |
JP3721614B2 (ja) | リードフレーム及び電子部品搭載用基板の製造方法 |